Brass heatsink - 12 x 12 x 1 mm for Raspberry Pi 4

Product Overview

• Passive brass heat sink for single-board computers
• Improves the processor’s heat dissipation
• Direct installation on the chip without additional electronics
• Suitable for typical development and continuous-operation projects

Product Description

A brass heat sink provides passive heat dissipation for single-board computers. The material dissipates the processor’s heat and prevents thermal throttling, where computing performance decreases due to overheating. Its benefits are particularly noticeable during longer computing tasks or in poorly ventilated enclosures.

The heat sink is attached directly to the processor chip, usually with thermal paste as the contact medium. Simple adhesive or mechanical fastening prevents it from slipping. No power supply or control is required; passive cooling works purely through physical heat dissipation.

In projects involving real-time data processing, image or video streaming, or continuous sensor evaluation, the heat sink prevents performance losses caused by overheating. It also stabilizes the processor temperature during 24/7 continuous operation for home automation or networking tasks. Use is straightforward as long as the enclosure has enough space for the heat sink’s height.

Before installation, the chip’s surface must be thoroughly cleaned so that the thermal paste adheres properly. Depending on the computer’s form factor and the chosen fastening method, additional materials such as high-quality thermal paste may be required.

Safety Information

This heat sink is a passive component without electronic parts and is intended exclusively for prototyping, testing, and development purposes. Work on or near electrical installations must be carried out by qualified electricians. If you have questions about safe integration into a system, consult a qualified electrician before commissioning.

Scope of Delivery

• 1x Single brass heat sink module for Raspberry PI 4 - 12x12x1 mm