QFN20 to DIP20 adapter board - 0.5 mm pitch, 2.54 mm spacing
QFN20 to DIP20 adapter board - 0.5 mm pitch, 2.54 mm spacing
This goes with it
Pay in 30 days
Pay in 30 days
Description
Product Overview
- Adapter for low-profile QFN20 components on DIP20 breadboards
- Assembly area for 0.5 mm pitch packages
- 2.54 mm pin spacing for the standard breadboard pitch
- Plated through-holes for reliable solder connections
- Small board suitable for experiment kits and prototyping
Product Description
This adapter converts surface-mount QFN20 components into breadboard-compatible modules. Many modern sensor and logic ICs are now only available in space-saving QFN packages. The adapter board allows these components to be used in circuits designed for DIP20 packages without modifying the circuit layout.
The IC is soldered onto one side, while the 20 connections extend toward the breadboard. The QFN package's 0.5 mm pitch is converted to the standard 2.54 mm pitch. The plated-through board provides secure connections and allows repeated reconnection without loss of quality.
The adapter is used for prototyping data acquisition, wireless communication, or signal processing applications when the available ICs are no longer offered in classic DIP packages. In training contexts, the module eliminates the need for cumbersome wiring of fine connections. Prior soldering experience is required, as the QFN package with its flat lead pads must be mounted precisely.
The package contains only the unpopulated board. The suitable QFN20 IC and any solder and flux required for surface mounting must be obtained separately. Soldering work on this assembly requires manual precision and suitable soldering equipment with a magnifying glass or microscope.
Safety Information
The adapter board is intended exclusively for prototype construction and testing and development purposes. When soldering surface-mount components, standard precautions against flux splashes and heat exposure are required. Anyone with insufficient experience in SMD work should consult an experienced person before assembly.
Package Contents
Contains only the unpopulated board. The suitable QFN20 IC and any solder and flux required for surface mounting must be obtained separately. Soldering work on this assembly requires manual precision and suitable soldering equipment with a magnifying glass or microscope.