Heatsink for NanoPi Fire3 and K1 Plus - aluminum, passive
Pay in 30 days
Pay in 30 days
Description
Product Overview
- Heatsink for NanoPi Fire3 K1 Plus single-board computer
- Passive cooling without a fan
- Direct contact with the CPU using thermal paste
- Enables higher clock speeds and longer operating times
- Made of aluminum
Product Description
The heatsink reduces the operating temperature of the NanoPi Fire3 K1 Plus through passive heat conduction. The selected design ensures silent operation because it does not include a fan. Instead, the heat generated by the CPU is transferred to the surroundings through an aluminum heat conductor.
The CPU is connected to the heatsink with a thin layer of thermal paste that compensates for uneven surfaces. The aluminum provides sufficient surface area for natural convection, allowing the processor to run more stably even under full load. This makes higher clock speeds possible without triggering the system's thermal protection and throttling performance.
It is particularly useful wherever the NanoPi is operated continuously under load, such as in home automation servers, media servers, or local database instances. The heatsink also helps maintain stable conditions in warm environments or during longer training runs for neural networks.
Clean the CPU surface before application. Apply the thermal paste in a thin layer; a thicker layer reduces heat conduction. The heatsink requires free air circulation and should not be used in hermetically sealed enclosures.
Safety Information
The heatsink is intended exclusively for building prototypes and for testing and development purposes. Work on or near electrical installations is reserved for qualified electricians; if anything is unclear, consult a qualified electrician before commissioning.
Scope of Delivery
- 1x heatsink for NanoPi Fire3 / K1 Plus (including screws and adhesive pad)